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    Thermal Management Solutions

    Why Thermal Management

    To operate efficiently and ensure reliability, heat must be removed from heat generating power components.

    As a result of faster speeds, reduced format, and more devices being populated on PCB’s, more heat is being generated that must be removed for efficient operation. The move to sustainable energy increased the demand for energy management electronics, which also create much heat because of the high electrical currents used in these applications (power inverters for solar and wind energy, powertrain electronics for HEV, etc).

    Thermal Management, through various applications, aids in directing heat away from heat generating system components.

    Typical applications for Thermal Management may include:

    Power Applications

    • Power amplifiers
    • DC power supplies
    • Power control systems
    • RF & MW applications

    Automotive

    • Motor control modules
    • Electric brake system
    • Power-train in EV

    High Speed Computing

    LED

    • Lighting systems - Automotive, Industrial, Consumer

    TTM's Thermal Management Solutions

    TTM offers a wide range of Thermal Management types to include Via Farms, Heatsinks/Pallets, Heatsink Coins, Embedded Coins, E-Coin, Press Fit Coin (PFC), Metal In-lay and Solder or Adhesive attach.

    Additionally, TTMs' Thermal Management Solutions include our patented embedded E-Coin technology along with heatsink coin attachment capabilities and heavy copper. Our expertise in RF & Microwave is unmatched in the industry.


    Via Farms

    Via Farms



    Press Fit Coin (PFC) Technology

    Press Fit Coin (PFC) Technology



    E Coin Technology

    E Coin Technology



    Heatsinks

    Heatsinks



    Metal In-lay

    Metal In-lay



    Solder or Adhesive Attach

    Solder or Adhesive Attach

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